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Optical device
Passivation layer
Constantan materials
Special Features
4x6" sputter system for R&D and small scale production.
Excellent thickness uniformity(below +-2.8% for the layer of 228.6 nm in thickness).
Highly smooth surface(RMS roughness of deposited layer: 25 Ã…).
RF/DC magnetron sputter.
Automatic loading system.
Average
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Available Excavators
1. KUBOTA - U-08 / U-10 / U-17 / U-20 / U-30 / KX-57 U-55
2. KOMATSU - PC18MR / PC20MR / PC30MR / PC50
3. YANMAR - SV08 / VIO15 / VIO15 / VIO20 / VIO30 / VIO35 / VIO55
4. KOBELCO - SK10 / SK17 / SK20 / SK27 / SK30 / SK35 / SK55
5. HITACHI - ZX8U / ZX10U / ZX17U / ZX30U / ZX35U / ZX50U
6.
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Hard materials coating(eg. CrN, TiN, TiAlN)
Anti-corrosive coating(eg. ZrN)
Special Features
Vacuum arc system for mass production(base pressure: 1 X 10-6 Torr).
Pumping system equiped with mechanical booster and oil diffusion pumps.
Automatically or manually controlled in substrate revolution and rotation.
Batch type of substrate
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Diaphragm Metalligations
Special Features
Roll to Roll System for mass production.
PC control based on PLC.
Metal deposition on flexible film
Flexible film thickness: 2um
Speedy deposition and throughput
Loading capacity : 5km per day
Average throughput 1,800km per year
Specifications
Dimension : 2,714L x 3,393H x 2,008W
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Available Excavators
1. KUBOTA - U-08 / U-10 / U-17 / U-20 / U-30 / KX-57 U-55
2. KOMATSU - PC18MR / PC20MR / PC30MR / PC50
3. YANMAR - SV08 / VIO15 / VIO15 / VIO20 / VIO30 / VIO35 / VIO55
4. KOBELCO - SK10 / SK17 / SK20 / SK27 / SK30 / SK35 / SK55
5. HITACHI - ZX8U / ZX10U / ZX17U / ZX30U / ZX35U / ZX50U
6.
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Deposition of low melting point materials(ex, Al, Mg, etc.)
Special Features
Thermal evaporation with roll coating system for mass production.
Continuous Al feeder system.
Speedy deposition and throughput.
Specifications
Loading capacity : 5km per day
Average throughput : 15,000km per year
Dimension : 1,730L × 1,200H × 1,000W
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Release coating of precision mold for forming digital camera and mobile phone lenses
Special Features
Ion beam-assisted dc sputter system for release coating on precision mold.
Equipped with three sputter guns and one ion gun.
Multilayer deposition and codeposition available.
Substrate heated up to optimum value in a short period, using
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Available Excavators
1. KUBOTA - U-08 / U-10 / U-17 / U-20 / U-30 / KX-57 U-55
2. KOMATSU - PC18MR / PC20MR / PC30MR / PC50
3. YANMAR - SV08 / VIO15 / VIO15 / VIO20 / VIO30 / VIO35 / VIO55
4. KOBELCO - SK10 / SK17 / SK20 / SK27 / SK30 / SK35 / SK55
5. HITACHI - ZX8U / ZX10U / ZX17U / ZX30U / ZX35U / ZX50U
6.
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CNTs growth
Special Features
Small DC arc discharge system for CNT(Carbon Nano Tube) synthesis.
SWNT and MWNT synthesis.
Average throughput Up to 10kg per year.
Carbon rod : 6phi × 30 mm.
Specifications
Dimension : 800L × 1,000H × 600W (mm3)
Power: DC 2kW
Gas : He/H2/Ar
Pump :
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BBAR and Magenta AR
Mirror coatings
Other various optical applications
Special Features
Cost effective multilayer coatings for functional coatings like antireflective and mirror applications of ophthalmic lenses.
Sputter system for multi-functional coatings with various size of lenses.
Specifications
Lens loading capacity : 4
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Available Excavators
1. KUBOTA - U-08 / U-10 / U-17 / U-20 / U-30 / KX-57 U-55
2. KOMATSU - PC18MR / PC20MR / PC30MR / PC50
3. YANMAR - SV08 / VIO15 / VIO15 / VIO20 / VIO30 / VIO35 / VIO55
4. KOBELCO - SK10 / SK17 / SK20 / SK27 / SK30 / SK35 / SK55
5. HITACHI - ZX8U / ZX10U / ZX17U / ZX30U / ZX35U / ZX50U
6. IHI -
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Dielectric materials in EL display device
Special Features
E-beam evaporation system for small scale organic EL device production.
In-line processed with glove box.
Side-sliding door type.
Smooth surface(RMS roughness < 20 nm).
Specifications
Wafer capacity : 1 × 5"
Average throughput Up to 5,000 wafers per year
Dimension :
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Metal coatings
Barrier layers
Special Features
Magnetron sputter system for R&D and small scale production.
High speed pumping system equiped with cryogenic pump.
Automatic robot loading system.
Automatic positioning system between guns and substrate.
Convenient control on touch screen.
Specifications
Power : AC 2kW (13.56MHz), DC
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The Desk Sputter Coater is able to coat non-oxidising metals - such as gold (Au) , Silver (Ag), Palladium ( Pa)and platinum (Pt) thin films on non-conductive or poorly conductive specimens uniformly and fine-grain size in fast cycle time .
The good design of the system able the user easily to load and unloading of samples and quickly change the
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Hard materials coating(eg. CrN, TiN, TiAlN)
Anti-corrosive coating(eg. ZrN)
Special Features
Vacuum arc system for mass production(base pressure: 1 X 10-6 Torr).
Pumping system equiped with mechanical booster and oil diffusion pumps.
Automatically or manually controlled in substrate revolution and rotation.
Batch type of substrate
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Ferromagnetic materials deposition
Oxides deposition
Metals deposition
Special Features
Ultra-high-vacuum sputter system for R&D and small scale production(base pressure: 6 X 10-9 Torr).
Pumping system equiped with ion and turbo molecular pumps.
Predeposition process of oxides or metals in load-lock chamber.
Automatic mask loading
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The web coater was precisely designed for researchers studying in many thin film related fields, especially for TCOs in flat panel display.
Applications
TCOs coatings
Metallization or passivation coatings
Summarized Features
Web coating system equipped up to 4 sputter cathodes for R&D and a small scale of production.
Automatic
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Hard coating, Ferromagnetic devices
Special Features
FVAS system for small scale production with 90 degree macro-particle filtering.
Magnet array designed specially for arc stabilization.
Constantly exhibits high ionization ratio.
Average throughput Up to 5,000 per year.
Specifications
Wafer capacity : 1 X 4"
Dimension : 1,030L ×
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Metal, ceramic, and alloy depositions for R&D in OLED fields.
Special Features
Cluster sputtering system for TCO deposition with two sputtering chambers and one glove box.
Robot transfer chamber between chambers and glove box.
Cassette loading type with glass holder.
Three tiltable 8" sputter guns and extra sputter gun ports in each
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Applicable to various R&D fields that sputter deposition of metals and ceramic materials is necessary.
Application areas: semiconductor, display, solar cell, biochips, new materials,
Special Features
RF or DC magnetron sputter for multipurpose R&D.
Codeposition and multilayer deposition available.
RF to DC power supply easily changed