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Touch Screen Panel manufacturing
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SiC coating, CNTs growth Normal CVD process
Special Features
Thermal CVD system for SiC coating with MTS bubbler system.
PC control based on PLC.
Convenient Al2O3 tube setup.
Ion exchange type scrubber for SiH4 and Cl gases.
High sensitivity gas detectors for H2, Cl, C3H8.
Uniform 3 heating zone.
Specifications Heating range ~
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CNTs growth
Special Features
Small DC arc discharge system for CNT(Carbon Nano Tube) synthesis.
SWNT and MWNT synthesis.
Average throughput Up to 10kg per year.
Carbon rod : 6phi × 30 mm.
Specifications
Dimension : 800L × 1,000H × 600W (mm3)
Power: DC 2kW
Gas : He/H2/Ar
Pump :
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BBAR and Magenta AR
Mirror coatings
Other various optical applications
Special Features
Cost effective multilayer coatings for functional coatings like antireflective and mirror applications of ophthalmic lenses.
Sputter system for multi-functional coatings with various size of lenses.
Specifications
Lens loading capacity : 4
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The web coater was precisely designed for researchers studying in many thin film related fields, especially for TCOs in flat panel display.
Applications
TCOs coatings
Metallization or passivation coatings
Summarized Features
Web coating system equipped up to 4 sputter cathodes for R&D and a small scale of production.
Automatic
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Optical devices
Barrier layer
Solar cell
Special Features
High density PECVD system for a-Si:H and nc-Si:H layer.
Low temperature deposition of a-Si:H layer(under about 300°C).
Robot transporting system.
Specifications
Wafer capacity : 1 × 4"
Average throughput : Up to 5,000 wafers per year
Dimension : 2,100L × 1,700H ×
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Dielectric materials in EL display device
Special Features
E-beam evaporation system for small scale organic EL device production.
In-line processed with glove box.
Side-sliding door type.
Smooth surface(RMS roughness < 20 nm).
Specifications
Wafer capacity : 1 × 5"
Average throughput Up to 5,000 wafers per year
Dimension :
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Metal coatings
Barrier layers
Special Features
Magnetron sputter system for R&D and small scale production.
High speed pumping system equiped with cryogenic pump.
Automatic robot loading system.
Automatic positioning system between guns and substrate.
Convenient control on touch screen.
Specifications
Power : AC 2kW (13.56MHz), DC
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Applicable to various R&D fields that sputter deposition of metals and ceramic materials is necessary.
Application areas: semiconductor, display, solar cell, biochips, new materials,
Special Features
RF or DC magnetron sputter for multipurpose R&D.
Codeposition and multilayer deposition available.
RF to DC power supply easily changed
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SiNx dielectric material coating
SiOx dielectric material coating
SiOxNy dielectric material coating
Special Features
Capacitively-Coupled PECVD system with loadlock chamber for R&D and small scale production.
Automatic loadlock system with cassette.
Uniform gas distribution through shower head.
Specifications
Substrate temperature
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Hard materials coating(eg. CrN, TiN, TiAlN)
Anti-corrosive coating(eg. ZrN)
Special Features
Vacuum arc system for mass production(base pressure: 1 X 10-6 Torr).
Pumping system equiped with mechanical booster and oil diffusion pumps.
Automatically or manually controlled in substrate revolution and rotation.
Batch type of substrate
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Ferromagnetic materials deposition
Oxides deposition
Metals deposition
Special Features
Ultra-high-vacuum sputter system for R&D and small scale production(base pressure: 6 X 10-9 Torr).
Pumping system equiped with ion and turbo molecular pumps.
Predeposition process of oxides or metals in load-lock chamber.
Automatic mask loading
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- We take pride in our Roll to Roll Sputter Vacuum equipment production and processing technologies,
based on a techniquedepositing metal on the polymer surface.
- Roll-to-roll sputtering equipment manufacturing and process technology has
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CNTs growth
Special Features
Small RF-PECVD system for CNT(Carbon Nano Tube) synthesis.
Low temperature synthesis of CNTs(under about 400°C).
Specifications
Heating range : 400 ~ 600°C
Average throughput : Up to 5,000 wafers per year
Wafer capacity : 1 × 4"
Dimension : 1,100L × 1,500H × 900W (mm3)
Power : AC 100W
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Hard coating, Ferromagnetic devices
Special Features
FVAS system for small scale production with 90 degree macro-particle filtering.
Magnet array designed specially for arc stabilization.
Constantly exhibits high ionization ratio.
Average throughput Up to 5,000 per year.
Specifications
Wafer capacity : 1 X 4"
Dimension : 1,030L ×
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Metal, ceramic, and alloy depositions for R&D in OLED fields.
Special Features
Cluster sputtering system for TCO deposition with two sputtering chambers and one glove box.
Robot transfer chamber between chambers and glove box.
Cassette loading type with glass holder.
Three tiltable 8" sputter guns and extra sputter gun ports in each
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Optical waveguide
Barrier layer
Special Features
SiO2 PECVD system for R&D and small scale production.
Excellent thickness and reflective index uniformity in deposited layer (avg. 7µm).
Highly smooth surface(RMS roughness of deposited layer : 30.6Ã…).
Transformer coupled high density plasma.
Specifications
Wafer capacity : 1 ×
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Coatings for PDP electrode protection(eg. MgO etc.)
Special Features
In-line system with 4 arc guns for dielectric materials deposition on 70 inch glass(base pressure: 1 X 10-6 Torr).
Equiped with mechanical, booster and cryogenic pumping system.
Automatically controlled in substrate moving.
Average throughput : Up to 30,000 sheets per
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Applicable to various R&D fields that sputter deposition of metals and ceramic materials is necessary.
Application areas: semiconductor, display, solar cell, biochips, new materials, nanomaterials, and sample preparations, etc.
Special Features
RF or DC magnetron sputter for multipurpose R&D.
RF to DC power supply easily changed without