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MC-3000 is the-state-of-art cutting fluids for Wafer or Ingot dicing such as Silicon, GaAS, GaP, etc with diamond blade. It’s really good coolant can reduce heat efficiently during dicing process. And it give the excellent lubrication, holding up under extream pressure, anti-corrosion, as well as following advantages for you.
1) When wafer
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MC-3000 is the-state-of-art cutting fluids for Wafer or Ingot dicing such as Silicon, GaAS, GaP, etc with diamond blade. It’s really good coolant can reduce heat efficiently during dicing process. And it give the excellent lubrication, holding up under extream pressure, anti-corrosion, as well as following advantages for you.
1) When wafer
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AbstractDiamond laser saw blade is ideal stone cutting blade, use for marble, granite, sandstone, limestone, basalt, grit stone, etc.
Features:
a. Applied to cut various natural and artificial stone.
b. High quality diamond and materials ensure high sharpness and long cutting life.
c. 100% laser