TBS SHEET Manufacturers,TBS SHEET Suppliers

Description

Product Introduction

We create the maximum efficiency in a repeatedly used environment by unifying silicone complex

resin and PI film with little change of numerical value and property of matter at high temperature

and pressure to minimize transformation during bonding according to complex pressure with

ICONE and by consolidating silicon layers of high-repulsive elasticity.

Characteristics

- We use PI film and silicone of little changes to the numerical value and property of matter in a

high temperature and pressure environment.

- We unify complex resin to minimize transformation during bonding according to repeated

pressure and consolidate silicon layers of high-repulsive elasticity for maximum efficiency in a

repeatedly used environment.

Usage

- TFT-LCD module processing bonding buffer

- PDP module processing bonding buffer

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