High Density Plasma Etching System for Magnetic Materials Manufacturers,High Density Plasma Etching System for Magnetic Materials Suppliers

Description

Metal, oxide, magnetic materials etching

Special Features

TCP etching system for R&D and small scale production.

Automatic robot transporting system.

Mechanical chuck and He backside cooling system.

Specifications

Average throughput : Up to 14,400 wafers per year

Wafer capacity : 1 × 4"

Dimension : 1,100L × 1,830H × 900W (mm3)

Power : RF 1kW for TCP source

RF 600W for bias voltage

Gas : C2F6 / He / SF6 / B6H6 / Cl2/Ar

Substrate material : Si/SiO2

Pump : Rrotary(450l/min, 900l/min) & Turbo(500l/s)

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