Cluster system for Oxide and Metal sputtering

Cluster system for Oxide and Metal sputtering

Cluster system for Oxide and Metal sputtering Made in Korea

Description

Metal, ceramic, and alloy depositions for R&D in OLED fields.

Special Features

Cluster sputtering system for TCO deposition with two sputtering chambers and one glove box.

Robot transfer chamber between chambers and glove box.

Cassette loading type with glass holder.

Three tiltable 8" sputter guns and extra sputter gun ports in each chamber.

Available in multilayer deposition as well as co-deposition.

Automatic control in substrate rotation and substrate to cathode distance.

Precision mask aligner with laser focusing.

Substrate temperature uniformity : <±2% over 200x200 glass.

System operation by PLC-based PC control.

Specifications

Glass Capacity : 5 × 200(mm3)

Dimension : 3,500L × 2,400H × 3,300W(mm3)

Power : AC 220V, three phase for main

RF 3,000W 2set for sputtering

DC 5,000W 2set for sputtering

Heater : SiC coated graphite (Max. 600°C)

Gas : Ar/N2/O2/H2/C2H2

Pump : rotary(1,000l/min) & TMP(400l/s) for transfer chamber

turbo(2,400l/s, 2set) & dry pump(1,900l/min 2 set) for main chamber


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