Ultrasonic Sputtering Target Bonding machine is used for soldering Indium on various sputtering targets such as Aluminum, Molybdenum and so on.
[Features]
1. Successful Soldering of any kinds of sputtering target
2. Full Digital Control
3. Ultrasonic Amplitude Adjustable : 10-100%
4. Auto Frequency Tuning : 30kHz +/- 1 kHz
5. Programmable Welding Time and Energy
( 10 memories for welding condition )
[Spec]: refer to attached specification
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