Semi-automatic Ultrasonic Grinding Machine

Semi-automatic Ultrasonic Grinding Machine

Semi-automatic Ultrasonic Grinding Machine Made in Korea

Description

Features Easy and comfortable operation than conventional grinder Wight pressure measured by magnetic enables to machine diamond dies of fine, medium, thick wire Exact centering is possible by adjustment X, Y axis Angle of dies holder is convertible during grinding process Automatic tuning system Simple operation by even beginners Ultrasonic generator is adjustable upto Ø5.50mm Increased high productivity saving operation time Uniformly ultrasonic generating(when we use Ø3.0mm, L120mm) Dies repairing service is possible from 0.10mm to 2.00mm Compact size

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