Application: this batch type system coats the conductive materials such as AUA, CU, AG on the substrate for shielding of the EMI(Electro-magnetic Interference).
Features: hight Throughput Design-minimization of the time for loading and unloading of substrate and optimization of pumping path.
- Easy work for target change by clamping type(target changing unit-optional item)
- The deposition is done during the substrates going round in the chamber where DC magnetron and evaoration source are installed.
sputter
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Payment & Shipping Conditions:
- Payment: We accept payment through Paypal Only.
- Shipping: We will ship the catalog once the payment is received. And you will be receiving the catalog with in 10 -14 busines days. Shipping might be delayed in due to international shipping conditions which is depends on the countries receiveing. In case hard copy of catalog is not available then we will ship the soft copy.
- Refund: We can refund the order before shipping process was initiated. Incase Catalog not available, we will make sure to refund the order.
- Note: This is a Catalog Produt.
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