Polishing material for sapphire wafers

Polishing material for sapphire wafers

Polishing material for sapphire wafers Made in Korea

Description

Application : Sapphire wafer lapping   Product characteristic - Particle size of the polishing slurry : 3, 4.5, 6, 9? - Increase in Material Removal Rates (MRR) - Improvement in polishing effects on the surface of sapphire wafers (Decrease in surface roughness [Ra])   Expected Effects - Higher than other companies lapping material is excellent and the amount of surface roughness can be implemented - Water-soluble abrasive, easy-to-clean and environmentally friendly working environment possible - Shorten the time for wafer abrasion (increased in the MRR (material removal rate))

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  • Payment: We accept payment through Paypal Only.
  • Shipping: We will ship the catalog once the payment is received. And you will be receiving the catalog with in 10 -14 busines days. Shipping might be delayed in due to international shipping conditions which is depends on the countries receiveing. In case hard copy of catalog is not available then we will ship the soft copy.
  • Refund: We can refund the order before shipping process was initiated. Incase Catalog not available, we will make sure to refund the order.
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