Standard Magnetron Sputter with 4x3

Metal, ceramic, and alloy deposition for basic research in various fields.Special FeaturesDeposition of metallic and inorganic layers is not only available, but partially applicable to organic materials deposition by adopting both rf and dc sources.Multilayer and codeposition in up or down-sputtering mode can be selectively chosen.Automatic loadlock system, which is compactly designed for space saving.Optimized configurations of sputter gun and shutter for minimizing cross-contamination between installed targets.Typical process data of various materials can be delivered on request.SpecificationsWafer capacity : 4in wafer or 100mm x 100mm glassDimension : 1,720L x 1,835H x 1,080W (mm3)Power : AC 220V, single or three phaseGas : Ar/N2/O2Pump: Rotary pump & turbomolecular pumpHeater : SiC heater 6" (Max. 600'C)Substrate bias : RF or DCLoadlock system : single wafer loading or cassette loadingSystem control : LabView-based PC control