Standard Sputtering System

Features Sputtering is used extensively in the semiconductor industry to deposit thin films of various metal and oxide materials. Thin anti-reflection coatings on glass for optical applications are also deposited by sputtering. Because of the low substrate temperatures used. Sputtering is MSS4000 is optimization equipment for R&D. Application Metal & Oxide coating Pt, Ti, Cu, Al and other metals ZnO, AZO, GZO, TiO2, SiO2 and other oxide materials Specification Magnetron Sputter Gun : 4inch Gun Type : Up to Down Film Thickness Uniformity : <±5% in 4inch Area Heating Temperature on Substrate : Max 600°C Heating Uniformity : <±5% in 4inch Area at Main Chamber Substrate Rotation : 5~20rpm Z-motion Unit(Target to Substrate Distance : 50~100mm) Position Sensor for Sample Loading / Unloading&T/S Distance Adjust DC Power Supply 1KW, RF 1ea, DC 2ea(Target cost : Option) Loadlock System(Optional Item) Full Automation Control System Using PC or PLC Based Touch Panel(Optional Item)