Features
- Reactive Ion etching(RIE) is an etching technology used in micro fabrication.- It uses chemically reactive plasma to remove material deposited on wafers.- High0energy ions from the plasma attack the wafer surface and react with it.
Application
Silicon etching
Dielectrics etching(SiO2, Si3N4, etc)
Polyamide etching
Specifications
Substrate Size : Piece to 6inch
Max. Temperature : 700°C (On Heater)
Process Gases Nozzle & RF Plasma Source Effective Area : 6inch
RF Power Supply : 13.56MHz, 600W
Gas Flow System -Flow Control Range : 0~100 scum-Gas : Ar, O2, SF6, CHF3(4Channel + Option)-Gas Panel in Jungle Box
All System Control using PLC Based Touch Panel(TFT 256Color)
Ultimate Pressure : <1 x 10-6 Torre within 10 min.
Standard Asher. RIE System
Description
Product Inquiry
Purchase Product Catalog
Payment & Shipping Conditions:
- Payment: We accept payment through Paypal Only.
- Shipping: We will ship the catalog once the payment is received. And you will be receiving the catalog with in 10 -14 busines days. Shipping might be delayed in due to international shipping conditions which is depends on the countries receiveing. In case hard copy of catalog is not available then we will ship the soft copy.
- Refund: We can refund the order before shipping process was initiated. Incase Catalog not available, we will make sure to refund the order.
- Note: This is a Catalog Produt.
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