Features
The irradiation cures the UV tape to remove the adhesive strength between the sheared wafer and UV tape for the improved efficiency in the Die Attach Process during the semiconductor packaging. An unmanned system has further been implemented by adding AGV to an existing UV Irradiator.
UV Irradiator
Description
Product Inquiry
Purchase Product Catalog
Payment & Shipping Conditions:
- Payment: We accept payment through Paypal Only.
- Shipping: We will ship the catalog once the payment is received. And you will be receiving the catalog with in 10 -14 busines days. Shipping might be delayed in due to international shipping conditions which is depends on the countries receiveing. In case hard copy of catalog is not available then we will ship the soft copy.
- Refund: We can refund the order before shipping process was initiated. Incase Catalog not available, we will make sure to refund the order.
- Note: This is a Catalog Produt.
Share UV Irradiator in Social Media