Startus

Startus

Startus Made in Korea

Description

 Electro-deposition of metal layers for wafer bumping, redistribution, integrated passives and MEMS. -Process Applications : Pb Solder, Cu bumps, Cu lines, Cu Via Fill , SnAg Bump, Au Bumps   Patented technology breakthrough     “After 20 years of development IBM, you are the first to take vertical   wafer plating into production.”   Designed specifically for advanced packaging, thick metal deposition   Process superiority: better yield on difficult applications   Flexibility   scalable capacity   quick wafer size change   ease of chemistry change   Lowest cost of ownership

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