Introduction
High Performanced Gas Mixers for welding, semiconductor, food packing machine
Our Technology
Based on well-established technology, our volumetric mixers are reliable and built to offer a long-life service. This cost effective series is ideal for harsh environments and difficult to handle and corrosive fluids. The SHGM 1000 direct readout construction is already standardized to your process conditions to simplify mix calculations. Set at your process conditions without having to worry about correction factors. This mixer provides superior precision compared to any fixed orifice gas mixers.
Benefits
SHGM 1000 series for increased productivity:
Provides excellent quality-price ratio.
Reduces costly gas consumption
Provides greater flow adjustment compare to fixed orifice based mixers.
Offers independent flow adjustment on all gas lines.
Eliminates human error by providing direct flow compensation correction.
Eliminates the need of additional controllers or flowmeters for process gas.
Features
Our SHGM 1000 series offers the following:
Simple, rugged and reliable design
Long term repeatability
Fully customizable programming for up to 3 gases
Wide range of metering tubes with high-contrast background for easy reading
Directly compensated flow readout
True reading with 5% accuracy
Provides five-to-one rangeability
Alarms to ensure that correct mixtures are being created
No gas shut-off during power failure and no human intervention required to reset the mixer
A surge tank can be added to improve immunity against process interferences and to allow flow rate
Remote alarm module option available for better mixing process management
All wetted parts can be cleaned for food or oxygen service
Typical Applications
1. Soldering, welding, shielding and cutting gas: CO2/Ar , O2/Ar , He/Ar ,H2/Ar
2. Leak Detection: He/N2, He/Air
3. Lamp Filing: N2/Ar
4. Cover gas for molten Metal: SF6/CO2/Air
5. Blanketing Atmospheres: O2/N2, N2/Air
6. Plasma, coating and laser gas mixture: H2/Ar/N2
7. Food packaging: N2/CO2/O2
8. Heat treatment, annealing and sintering operation: H2/CO, H2/N2, CO2/Ar, N2/Hydrocarbons
9. Semiconductor wire bonding: H2/N2
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