FLP-16:
MAX Die Size : 3.07x2.06mm
Pad Size: 3.30x2.30mm
Die Attach:
Lead Frame
Lead Finish: Sn 100%
Wire Bonding: Au Wire 20~25㎛
Wafer Thickness: 170/290㎛
Mold Compound: Halogen Free
Marking: Laser
Packing Option: Tube, T & R
FLP-16:
MAX Die Size : 3.07x2.06mm
Pad Size: 3.30x2.30mm
Die Attach:
Lead Frame
Lead Finish: Sn 100%
Wire Bonding: Au Wire 20~25㎛
Wafer Thickness: 170/290㎛
Mold Compound: Halogen Free
Marking: Laser
Packing Option: Tube, T & R
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