TFS6:
MAX Die Size | 0.29 x 0.24mm Detail Info |
Pad Size | 0.35 x 0.30mm |
Die Attach | Eutectic |
Lead Frame | |
Lead Finish | Sn 100% |
Wire Bonding | Au Wire |
Wafer Thickness | |
Mold Compound | Halogen Free |
Marking | Laser |
Packing Option | T & R |
TFS6:
MAX Die Size | 0.29 x 0.24mm Detail Info |
Pad Size | 0.35 x 0.30mm |
Die Attach | Eutectic |
Lead Frame | |
Lead Finish | Sn 100% |
Wire Bonding | Au Wire |
Wafer Thickness | |
Mold Compound | Halogen Free |
Marking | Laser |
Packing Option | T & R |
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