ATS-PVD-Series Multisputter With 3x2in Or 3x3in Guns

Applicable to various R&D fields that sputter deposition of metals and ceramic materials is necessary.

Application areas: semiconductor, display, solar cell, biochips, new materials,

Special Features

RF or DC magnetron sputter for multipurpose R&D.

Codeposition and multilayer deposition available.

RF to DC power supply easily changed without hardware change.

Deposition available for various materials of metals, carbon materials, metal oxides and metal nitrides, etc.

Economical space needed for installation.

Efficient deposition through easy operation.

High performance to low cost.

Target shutter, view port shutter and chamber liners installed.

Ar gas introduced between cathode shield and target for high sputter yield.

Reactive sputtering also available.

Specifications

Target size: 2in to 3in.

System control: PLC-based touch panel.

Substrate holder size: normally up to 4in wafer.

Substrate heating: basically not heated or water-cooled (optionally heated up to 600oC).

Bias plasma applied to substrate holder (optional).

Target to substrate distance: up to 150mm controllable.

Sputter power supply: RF (13.56MHz) 600W, 2set with matching circuit and DC 600W, 1set.

Process gas: Ar, O2, N2.

Vacuum gauge: low and high vacuum gauges.

Base pressure: <5.0E-7Torr.

Pumping system of TMP (450 l/s)+rotary oil pump (600 l/min) (dry pump is optionally available).

Power: 220V, 3phase, 60A.

Water: <20oC, 2kg/cm2, 20l/min.

Compressed air: 5kg/cm2.

Weight: 650kg.

Dimension: 1,421mm(W) x 875mm(D) x 2,200mm(H).