[Product Description]
-Solder Ball
Solder balls are commonly used in area array package such as BGA, CSP & Flip-Chip, which forms electrical & mechanical solder joint between Pacakge Substrate & Main PCB and more recently micro bumps for inter connection instead of Au or Cu wiring. Duksan Hi-Metal is one of world top class solder balls makers with its wide product line from normal to special & innovative production system and has especially provided value more than quality, price & delivery-wise with contineous & outsandting technical services to fullfill customer's demands as meaning of total solution provider.
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[Company Introduction]
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