BOC (Board on Chip)(Pd No. : 3009312) Manufacturers,BOC (Board on Chip)(Pd No. : 3009312) Suppliers

Description

BOC

BOC (Board on Chip) : BOC is the structure that connects bonding pad on substrate to the bonding

pad of chip with memory chip bonding side to the laminated substrate by using wire-bonding
in the central slot.

It has characterstics to have the bonding and solder side of the substrate in one plane and It replaced

the previous lead fram into laminated substrate , which enables I/O pins to diversify and Chip to stack
vertically, thus it is widely used in memory chip as it is easy to perform high speed & high density.

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