[Product Description]:
PECVD ACL equipment is essential for the front end process of semiconductor manufacturing. It deposits an Amorphous Carbon Layer(ACL) on the surface of a wafer by generating the plasma in a vacuum chamber.
TES is the first and only local equipment manufacturer that successfully adopted PECVD ACL equipment for mass production among of local device companies.
With the increasing concentration and micronization of semiconductor devices, the application and frequency of using PECVD ACL equipment is rising.
Also, since TES PECVD ACL equipment has excellent price and quality competitiveness against foreign major companies, market share is expected to rise continually.
[Product Features]:
- Wafer Size : 12 inch (300mm)
- Process Application
PE-SiH4, ACL (Amorphous Carbon Layer)
- SiN, SiON (HM , IMO1/2, Arc, Pass2 Dep.) - Excellent mechanical throughput
- EFEM : 400WFS ≥
- Vacuum robot : 400WFS ≥
- W/AL : 230WFS ≥ - Outstanding Productivity
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