WCS-3F

WCS-3F is Water soluble protective coating layer that prevent thermal adhesion of itself and laser processing particles(debris) and de-lamination of layers.

* Features:

Excellent coating ability onto wafer surface

• Easy and wide spreading over all corner of wafers

• More excellent coating ability onto Multi-layered wafers such as Gallium Nitride or Saphire, etc and wafer with bumps.

• Best suited for laser processing of Convex-Concave wafer.

• It shows a good lebelling effect on wafer surface during Spin coating process.

• Better for wider wafers above 300mm

Higher thermal stability on UV laser

• Good to Chipping and Delamination (Peeling) controls.

• Due Higher thermal stability against UV laser, good for debris control..

Ease to clean(Easier removal)

• Best compatibility with Deionized water. It makes no residues after cleaning.

• Due Higher thermal stability against UV laser, good for debris control..

Qualified

• It was already qualified by global wafer dicing companies through our partners.

Price competitiveness

• With much smaller volumes of WCS-3F, you can implement your task during process.

• And also Price is cheaper than competitor’ one.

• Please compare it with others. And ask us to down. We will try to meet your target.

* Spec:

Items

Test method

Spec.

Results

Materials

PVP substrate

Viscosity

Brookfiled Viscometer (DV-?+Pro, Spindle No. 2, 20rpm)

cps

100~300

pH

pH meter

At 20?

4~5

Appearance

Transparent liquid