MC-3000 is the-state-of-art cutting fluids for Wafer or Ingot dicing such as Silicon, GaAS, GaP, etc with diamond blade. It’s really good coolant can reduce heat efficiently during dicing process. And it give the excellent lubrication, holding up under extream pressure, anti-corrosion, as well as following advantages for you.
1) When wafer sawing, MC-3000 provides increased penetration into the cutting surface, minimize abrasive friction between the rotating blade and wafer. It reduces debris accumulation in the blade area
2) Lowers debris accumulation and prevents heat generation when...