Cutting fluids for Diamond wire sawing of wafers and Ingots

Wafer-machine cutting oil and/or water based fluids provided a metalworking coolant as well as lubrication, stands up to extreme pressures and provides anti-corrosion properties as required. This usage is for semiconductors, solar cells, LED (Light Emitting Diode) and others items depending on the material type and characteristics of Ingot material.

DWF-722 is the water based cutting fluid used for Diamond Wire Sawing of solar cell wafers ingot. The main ingredient is Nonionic surfactant of Polyoxyalkyene Glycol Nonionic Surfactant. The produce is very good in providing an excellent lubrication, cooling, wetting, rust resistance and holding up under extreme pressure. Use this with a mixture of 5% diluted with ion exchange water. This cutting fluid can be reused over again, reducing the wafer manufacturing cost if an installation of removal system of silicon fine powder which is used during sawing.

DWF-765 is the water based cutting fluid used in a Diamond Wire Sawing of Sapphire wafer in the LED manufacturing process. The main ingredient is non-ionic surfactants of Polyoxyalkyene Copolymer. This product has proven to be excellence in lubrication, wetting, under extreme pressure and as anti corrosion. Use in a 5% dilute with ion exchange water.

* Features: - Excellent Lubrication

- Excellent cooling,

- Good wetting,

- Excellent rust resistance

- Excellent holding up under extreme pressure

- Price competitiveness

* Spec:

Product

DWF-722

DWF-765

Base polymer

Polyoxyalkyene Glycol

Polyoxyalkyene Copolymer

Appreance

Yellowish Liquid

Yellowish Viscous Liquid

S.G (at 20?)

1.03~1.04

1.06~1.07

pH (at 20?)

10.0~11.0

9.0 ~ 10.0

Water solubility

Perfect

Perfect

Viscosity ( cps at 25?)

3~7

100 ~ 130

CODMn(?/l, 5% dilluted)

7,000~8,000

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