Cutting fluids for Diamond blade sawing of wafers and Ingots

MC-3000 is the-state-of-art cutting fluids for Wafer or Ingot dicing such as Silicon, GaAS, GaP, etc with diamond blade. It’s really good coolant can reduce heat efficiently during dicing process. And it give the excellent lubrication, holding up under extream pressure, anti-corrosion, as well as following advantages for you.

1) When wafer sawing, MC-3000 provides increased penetration into the cutting surface, minimize abrasive friction between the rotating blade and wafer. It reduces debris accumulation in the blade area

2) Lowers debris accumulation and prevents heat generation when wafer sawing because of improved wetting of wafer surface and reduction of surface tension.

3) This product removes the debris factor of silicon and galvanic effect of the bond pad, while enhancing the electrochemical charge balance providing protection to the bond pad.

4) Makes it possible for fast removal of debris due to increase of acoustic strength

5) Reduces debris re-adhesion due to low ionic strength

6) All the debris is removed and cleaned from the entire process, reducing the movement of electromagnetic materials

7) Reduces damage from the lowered ESD which is generated from the friction of the blade or wafer sawing

8) Superior of cooling, lubricating and cleaning effect when wafer sawing 4?4mm~15?15mm chip by blade

9) Superior non-corrosive on the wafer pattern

10) Economical due to low concentration dilution of Max 3000 for sawing and cleaning

11) Due to newly designed and developed semi-conductors products, our MC-3000 is developed and produced in accordance with the requirements of the customer.

* Features:- Refer to mentioned upper message

* Spec:

Items

Results

Test method

Main Ingredient

Nonionic Surfactant

Appearance

Translucent Liquid

Visual test

pH (at 20?)

5~6

pH meter(Orion 520A)

SG (at 20?)

1.02~1.03

Hydrometer(Fisher Scientific)

Dilution ratio

3000:1