Mask Aligner

Features This instrument is a single-side exposure proximity/soft contact/contact mask aligner having two separate paired sets of objective lenses, one above the alignment stage and the other in the substage to enable the designated area of a wafer surface to be accurately exposed for patterning in conjunction with the bottom surface pattern, It is effective for a mask- to- wafer patterning in the R&D of MEMS elements such as semiconductor pressure sensors. System Specification Model PEM-800 PEM-6M Photomask size Max. 5-inch Max. 7-inch Wafer size Amorphous~ 4 inch Amorphous~ 6 inch Mask holder sliding Manual chuck Manual chuck Mask movement X=+-3 mm, Y=+-3 mm X=+-3 mm, Y=+-3 mm Alignment scope Objective lenses: 10x two symmetrical pairs. Eyepieces : NWF 10x,one pair Total magnification:100x Objective lens separation:15~90mm(800),80~140mm(6M) Field of view: split field Scope:Relocating and rotatable. Y axis movement: 80mm Focusing Unit Alignment repeatability within 5 micro Exposure Proximity/soft/hard contact/ Resolution 3 micro L/S Exposure unit 250W ultra-high pressure mercury 500W ultra-high pressure mercury Exposure mode mode 1 :each wafer is equalized,aligned, exposedmode 2:After the first wafer is once equalized,the second is immediately exposed by keeping the print gap constant,omitting equalization and realignment. Dimensions(main) 750Wx850Dx1700H mm 940Wx860Dx1670H mm Net Weight 450 kg 550 kg Utilities Power supply:100~220V AC 50/60Hz, 600W (main)100~200V AC,50/60Hz,550W(mercury)N2 gas,0.4~o.5 MPaVaccum below -80KP Power supply:100~220V AC 50/60Hz, 600W (main)100~200V AC,50/60Hz,1100W(mercury)N2 gas,0.4~o.5 MPaVaccum below -80KP Standard configuration Alignment & Objective Scope:10x,two pairs,symmetrical standard photomask & wafer holder : one controller power supply unit for mercury lamp and main unit Table Option NWF 15x eyepieces(paired) TV equipment Others