Nanosurface - Automatic Grinding System

Nanosurface - Automatic Grinding System

Nanosurface - Automatic Grinding System Made in Korea

Description

Feature High precision spindle For high machiine stiffness and process precision and excellent repeatability without black-lash. High precision work feeding system Newly upgraded work feeding system ensures micro unit pitch, a very fine dorwading pitch in a smooth manner with higher precision. It is therefore very easy to control measurement. All machine status, machines ready condition Fault display, are displayed by LED lamp in operating panel for opreratior's easy access. All Axis Control by the PLC For more diverse and stable process, All axis (wheel, work, feeding) are controlled wery sensitively by high perfomance inverterwith PLC. One touch vacuum clampling system Special Function In process thickness measuring In process grinding wheel dressing In process wheel wear off set Computerized control system Application Sapphire, Silicone, GaAs, GaN wafer back-grinding, Ceramic, Ferrule, Video Head Block Surface, Quartz, Optical Lens & Prism, Mold Product, etc.

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