300mm Wafer Sorter

 FeaturesRobot in Planing System Transferring Using Multi-jonts   Small Foot Print   Customize version of software available for maximum work efficiency   4 axis Clean Robot available   Uer's unique requirments are fully met through individually developed Software   Free support, regardless of warranty specifications (whenever new versions of software become available)Specification- SYSTEM CONFIGURATION -   1. MTBF / MTBI: = 4000Hrs / = 500Hrs   2. MWBI: = 10,000Wafers   3. MTTR: = 2 Hrs   4. Mpping: FOUP Opener Mapping or Robot Mapping   5. ID Reading Type: BAR Code Reading or RF ID Reading   6. Foot Print: 940(W) × 1590(D)   7. Throught- Put (Without Align & OCR): = 500 wfs / Hrs                           (Without Align): = 300 wfs / Hrs                           (Without Align & OCR): = 200 wfs / Hrs   8. Transfer Relisbility: = 50,000 Wfs no error   9. Mapping Reliability; = 50,000 Wfs no error   10. Pre- Alingn Reliability: = 50,000 Wfs no error   11. Multple End - Effect: Signal Arm   12. WF ID Reading Type: OCR Reading Type   13. loadports(MAX): 3EA   14. Pick - UP Tip Type: Vacuum Type   15. Hsot Communicaition Metode:  SECS ll GEM or HSMS   16. OS / Applicaition Program Tool: Windows NT & Windows 2000 / High Language   17. lonization: OK   18. AMHS(AGV / OHT / REV): OK   19. PWP: = 0.73 PWP   20. FFU Air Flow Spec: 0.4 m/s D.O.P 99.9999% / 0.12?   21.  FOUP Type(13/25): The same time of possible