TFSM:
MAX Die Size 0.37 x 0.28mm
Pad Size: 0.43 x 0.34mm
Die Attach: Eutectic
Lead Frame
Lead Finish: Sn 100%
Wire Bonding:Au Wire 18~23㎛
Wafer Thickness:100㎛
Mold Compound
Marking:Laser
Packing Option:T & R
TFSM:
MAX Die Size 0.37 x 0.28mm
Pad Size: 0.43 x 0.34mm
Die Attach: Eutectic
Lead Frame
Lead Finish: Sn 100%
Wire Bonding:Au Wire 18~23㎛
Wafer Thickness:100㎛
Mold Compound
Marking:Laser
Packing Option:T & R
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