ULP-4:
MAX Die Size | 0.39 x 0.39mm |
Pad Size |
0.45 x 0.45mm |
Die Attach |
Eutectic |
Lead Frame |
|
Lead Finish |
Sn 100% |
Wire Bonding |
Au Wire |
Wafer Thickness |
|
Mold Compound |
Non-Halogen |
Marking |
Laser |
Packing Option |
Reel |
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