UDFN-8:
MAX Die Size | 1.02x 0.27mm |
Pad Size | 1.20x 0.46mm |
Die Attach | Epoxy |
Lead Frame | |
Lead Finish | Sn 100% |
Wire Bonding | Au Wire |
Wafer Thickness | |
Mold Compound | Non-Halogen |
Marking | Laser |
Packing Option | Reel |
UDFN-8:
MAX Die Size | 1.02x 0.27mm |
Pad Size | 1.20x 0.46mm |
Die Attach | Epoxy |
Lead Frame | |
Lead Finish | Sn 100% |
Wire Bonding | Au Wire |
Wafer Thickness | |
Mold Compound | Non-Halogen |
Marking | Laser |
Packing Option | Reel |
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