CMP Slurry Abrasive
In the semiconductor manufacturing process, Chemical Mechanical Polishing (CMP) is a technique used in semiconductor fabrication for planarizing the top surface of an in-process semiconductor wafer. In CMP process, the semiconductor substrate is polished by metal-oxide slurry using elastomer pad. According to the substrate, the process is consists of ILD, STI, and metal CMP. Generally, metal-oxide slurry for CMP is in need of stable dispersion, high removal rate, less defect such as scratch on the surface after polishing, high purity chemicals.
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