At LCD Module process,By FOG Bonding badness COG, FOG that become Bonding at Rework work as long as it is Glass And that remove effectively without damage of LSI It is Rework Tool.
* COG REWORK- Uses Teflon Film and reduces damage of LSI - From twisting furtively after supply plenty calory setting proper hour a Glass side Separation
* FOG REWORK- In lifting Tool furtively from side making heating early hour work completion - In 2 seconds after heatings at 1~3 second from 300? Remove FPCB...