Product DescriptionF gas,which is heightened in reactivity by having been activated using ctclone arc plasma, is supplied to the pipes within the semiconductor manufacturing process, thereby removing powder that is adhered to, or will potentially adhere to, the internals of poping.
Product Feature- Utilize know-how acquired through years of experience in applying scrubber technology
- Completed verification regarding the responsiveness to powder and the quality of the operating system
- Prevents potential dangers that may occur within the pipes
- Attained pricing competitiveness in...