RTA - Rapid Thermal Annealing System

FA-RTP can be profit for the processes that require minimization of process time and thermal buggets of substrated such as thin gate oxidation, rapid annealing of deposited film, etc. Application Generally, AM-OLED, TFT-LCD, Low-K dielectrics, post implanting annealing, semi-conductor fabrication. Technology Optimized hardware and temperature control Excellent temperature uniformity Capability of alternative ATM & vacuum process 2~4 inch wafer mountable Bench top type of compact design (L700mm x W400mm x D450mm) Specification 1 rectangular type process vacuum chamber water cooling for chamber wall /radiation shield Ni-Au surface coating for reflector O-ring sealed sliding door Double side radiation heating with halogen lamp Ramping ratio of temperature : heating up to 1,000 °C Temperature uniformity : Ø2% on 4 inch wafe Programmable temp. controller 2~4 inch wafer mountable Low vacuum pumping system Up to three(3) gas lines User friendly PLC control with touch panel