Introduced in 1997 and designed for photoresist strip providing high productivity and low CoO/CoC performances. Featuring modular design of mainframe and two single type process chambers configured with downstream microwave plasma module on top of each process chamber. DAS2000 system provides a compact system design with high repeatability and residue free process using microwave plasma source. DAS2000 system integrates the production proven technologies to offer high throughput implant strip and post etch clean process solution. The downstream microwave source delivers the excellent process control and damage free to the underlying exposed film. DAS2000 system also provides photoresist popping free solution in high dosed implanted process with ISBP (In-Situ Bake Process) which is solely company patented.
DAS2000 Specification
System
6 ~ 8 Inch wafer
Electrical requirement
208 VAC, 3 Phases, 5 Wires
Temp. control range
80~300CãÂÂ?ÂÂ?
Dimension (mm)
890W x 1,900D x 1,970H
Transfer system
Two cassette stages ,Dual arm robot
Cooling stage
One water cooled cooling station
Power Source
MicrowaveãÂÂ?ÂÂ?
Software
Window NT base
Throughput
120/Hour (Mechanical Throughput)ãÂÂ?ÂÂ?
Process gas
O2,N2 (N2/H2,CF4 is optional)
Application
High Energy / Medium Current / High Dose Imp / Gate / Bit Line / Capacitor / Contact / Via / Pad / Descum
200mm Ashing System (DAS2000)
Description
Product Inquiry
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Payment & Shipping Conditions:
- Payment: We accept payment through Paypal Only.
- Shipping: We will ship the catalog once the payment is received. And you will be receiving the catalog with in 10 -14 busines days. Shipping might be delayed in due to international shipping conditions which is depends on the countries receiveing. In case hard copy of catalog is not available then we will ship the soft copy.
- Refund: We can refund the order before shipping process was initiated. Incase Catalog not available, we will make sure to refund the order.
- Note: This is a Catalog Produt.
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