ZIVIS II is a high volume production Plasma Oxide Cleaning (POC) system for processing 300mm wafers. A dry cleaning solution is implemented to overcome the disadvantages of using the wet cleaning process, in which dry cleaning is becoming more critical in areas where semiconductor manufacturing technology is becoming more complex and minute. Zivis II is designed to meet the semiconductor industry standards for cleaning processes. It has delivered more consistent results while maintaining the safety threshold for particles when compared to batch type systems. The new POC system also has a cassette loadlock that can hold up to 25 wafers, and a dual pick-up/down robot for increased productivity.
300mm Dry Cleaning System (ZIVIS II)
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Payment & Shipping Conditions:
- Payment: We accept payment through Paypal Only.
- Shipping: We will ship the catalog once the payment is received. And you will be receiving the catalog with in 10 -14 busines days. Shipping might be delayed in due to international shipping conditions which is depends on the countries receiveing. In case hard copy of catalog is not available then we will ship the soft copy.
- Refund: We can refund the order before shipping process was initiated. Incase Catalog not available, we will make sure to refund the order.
- Note: This is a Catalog Produt.
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