As devices are being highly accumulated and detailed, organizing Swallow Junction, Low Terminal Budget and Thermal Stress according to large diameter are being strongly required. This equipment is quick heat treatment device suitable for massive production of 8" and 12". wafer Massive production and efficiencies might be maximized through the optimized Foot Print of Two Chamber Type and various public applications.
Benefits and Features
High Precision Temperature ControlBy measuring the temperature of (high precision temperature control) wafer surface directly, it realizes high precision...