Vacuum Heating System for Voids Free Soldering&Annealing Manufacturers,Vacuum Heating System for Voids Free Soldering&Annealing Suppliers

Description

Wafer bump reflow and SMD soldering

Photo sensitive materials curing

Rapid thermal annealing and alloying

Package lid sealing

Special Features

Soldering and rapid thermal annealing under vacuum.

High heating rate using halogen lamp(Max. Temp. 800oC on request).

Process recipes based on customer equest.

Automatically controlled by PC.

Rapid ramping : >200°C/min on the top of graphite plate heated by quartz lamp.

Ramp down : ~100°C/min with graphite plate and<20°C/s without graphite plate

Ramp rate is precisely controlled

Heated area: 6 inch

Substrate cooling by N2 gas or water according to application process

Longitudinally movable substrate holder

Up to 6 gas lines, 2 gas lines standard

Specifications

Wafer capacity : 1 × 6"

Average throughput : Up to 18,000 wafers per year

Dimension : 990L × 1,143H × 900W (mm3)

Customer specific processes or option on request

Power : 220V, 3 phase, 50A

Gas : N2 / Ar

Susceptor material : stainless steel 304

Heater : halogen lamp

Pump : Rotary (600 l/min) & Turbomolecular pump(optional, 600 l/sec)

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