Magnetron Sputter System with 4x6

Magnetron Sputter System with 4x6

Magnetron Sputter System with 4x6 Made in Korea

Description

Optical device

Passivation layer

Constantan materials

Special Features

4x6" sputter system for R&D and small scale production.

Excellent thickness uniformity(below +-2.8% for the layer of 228.6 nm in thickness).

Highly smooth surface(RMS roughness of deposited layer: 25 Å).

RF/DC magnetron sputter.

Automatic loading system.

Average throughput Up to 100,000 wafers per year.

Specifications

Wafer capacity : 20 x 4"

Dimension : 1575L X 1269H X 930W (mm3)

Power: AC 1.2kW for sputter source

AC 600W for substrate bias voltage(13.56MHz)

Gas : Ar / O2 / H2

Pump : rotary(980l/min) & turbo(1000l/s)


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