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Product name : Self-bonding Litz wire
Specification : 0.08mm x 105 strands
Appication : Wireless power, Non-contact charger, Contactless charger for Smart phone, Cell phone,
Laptop computer etc.
01. Heating up after
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O-Ring
Large size O-rings and special standard products
In order to produce large size products, other manufacturers apply the separate processes, such as
compression process, connection process, and bonding process due to their limitation of production
capacity.
Because of these separate process, many kinds of quality problems occurred
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Carbon Paper
Material: Chopped carbon fiber(3~12mm)
Process: dissolication -> web -> drying -> heat-treatment
Application: WC sintering, Fuel-cell, Gas Diffusion
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â–¶ WC tip bonded to enhance the surface wear resistance of conventional steel tappet
â–¶ Patented Chemistry of WC to bond 2 different materials (WC, and Steel)
â–¶ Application: Tappet (Diesel engine
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WC Rod used for WC tools
â–¶ Rod shape material (OD:Ø1~50, Length: Max330mm)
â–¶ Wear-resistant materials for industial parts
â–¶ Application: Drill, Micro Drill, Endmill, and various industirial
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WC Powder For Thermal Spray
â–¶ WC Base used for thermal spray process
â–¶ Homogeneous powder size distribution, and good flowability
Application: HVOF, PTA, Laser Cladding, 3D
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Bonding Sheet (Tool PAD) When you want to performs task such as PCB bonding to connect the PCB and film bonding to connect the TAB(Tape Automated Bonding) coe(chip on Glass) bonding, CORChip on film) bonding, and panel glass of the manufacturing process of the module, and pressure buffering effect through a direct connection to the Toorrip It Is
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Bonding Sheet
Using the ACF(Anisotropic Conductive Film) from LCM Module Process of FPC and TFT-LCD, and is used for applications that are mounted PCB Ass'y and Drive Ass'y, the Panel Ass'y. and Tool from the heat of the TCP, PCB protects and heat pumping is used as a buffer sheet.
It is used as an insulating thermal pad sheet,
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Bi-Metal Bearing containing lease than 4% of lead(Pb) satisfying