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Introduced in 1999 and designed for FEOL photoresist strip providing high productivity and low CoO/CoC performances. Featuring modular design of mainframe, it is consisted of standard two process chambers and max. three process chambers can be configured with. Each chamber processes two wafers at a time with high throughput.
TERA21 system
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Introduced in 1997 and designed for photoresist strip providing high productivity and low CoO/CoC performances. Featuring modular design of mainframe and two single type process chambers configured with downstream microwave plasma module on top of each process chamber. DAS2000 system provides a compact system design with high
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Profiler is a new generation Multi-Application system that performs Pattern Profiling and Plasma Oxide Dry Cleaning (POC) utilizing a Point Inductively Coupled Plasma (PICP) source for semiconductor manufacturing under the <3Xnm design processes. It supports a wide process window utilizing chuck & baffle temperature controls, high &