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Package Type : TSOP, SOP, TQFP, QFP, BGA, CSP…Parallelism : 512 Max IndexTime : Less than 4.5 secondsUPH : Over 25,000Jam Rate : Less than 1/10.000Minimum Test Time : 70sec. based on 512 paraTemperature Capability : -40 ~ +125?Vertical Test Head Docking Quantity of Sorting Bins : Up to 12 categoriesLoading Tray Capacity : 120 User Trays at one
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Application QFP, BGA, CSP, TSOP Description Increased Testing Throughput Possible to test hot temp.(135?) 4 type contact mode (single, Dual, Inline Quad, Square Quad)
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Application O/S test for all type of BGA strip Description High productivity, Performance, Flexibility, Cost effective Reject unit marking Single device, Array BGA strips Pogo pin, Pogo socket and Resistance silicon contact
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Application All SOIC, SOP, SIP,DIP Package Test Description High Performance (UPH:4500 with test time 0.5sec) Easy Maintenance Pentium pc control with GUI
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Features
The kit is used to configure the test setups, including the transfer and contact of a device in a handler that inspects the finished semiconductor IC, and identify the compliance of the device. The component specification varies depending on the handler type, package and test socket, to be used for the
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Features
The Shortest Conversion Time
Easiness to convert
User display monitor and handling switch
Convenience of tray moving.
2 Axis auto pitch of picker
Auto teaching
Easiness to Maintain
Specifications
UPEH(UPH)
6.260 EA/H (4site, 48LQFP07 x 07)
Index Time
Within 0.45 Sec.
Cycle Time
Within 2.3 Sec.
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Features
Enhanced productivities through the shortest index time(UPEH 96,000 EA/H Reel Change Time=0,Test Time=0, Reject=0,)
Double Test head
Two Reject Mark Punching
Automatic Tape Transport System
Mechanical disconnection of 8 modules in parallel(short circuit punch)
Available backward & forward function by joy key
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Features
32Parallel
Minimize Index Time
Loss Time Zero by Sorting
Automatic Socket Off Function
Open Stacker Type
Direct Contact System
Ensure the Stability By Using Verified Program
Specifications
UPEH(UPH)
More than 5700 EA [(60 x 60) / (15 + 5)] x 32P = 5,760
Index Time
5 Sec. [Max]
Cycle Time
15 Sec
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Feature
Auto Laser Marking Handler System
Full Flexible Type for PLCC, QFP, tQFP Package & In-tray Device
2 Stock Magazine Loding/Unloding by Turn Table Type
Auto Adjustable Device for Feeder Rail Width by Servo Motor
Pre & Post Cleaning Function for Removal of Dust & Hum on the Device
In/Out Vision Camera Install for