# Function & Features   - Automatic chemical-etching the multi-layer of die(wafer) - The world’s first automation system. - Easy control through convenient GUI - Real-time inspection through enlarged images - Repetitions made simple using recipe files - Forced removal system for harmful gases - Safety that needs no

# Function & Features   - Using End mill for the milling of EMC - Fast, safe, and accurate milling work- Prompt and accurate milling by robot motions (Average   milling time < 1 min.) - Robot motion (X, Y, Z axis) having the precision of minimum   0.01mm (10?) - Automatically recognizing the

# Function & Features   - All the works necessary for decap are realized through   Auto Decaper. - The automated robot decapsulation system that has been   developed first in the world - The functions of milling, etching, heating, acetone cleaning,   drying, ultrasonic cleaning, and vision

# Function & Features   - Automatic chemical decapsulation equipment - The functions of etching, heating, acetone cleaning, and   drying available - Protecting workers from harmful chemicals - Minimizing damage etching of copper in the case of copper   wired IC - Minimizing the damage on the ball or

[Function & Features] - Automatic laser decapsulation system - All types of semiconductor package can be removed - Any material(Au, Cu, Al) of wire part and 2nd bonding area can be opened  - Effective decapsulation solution for Cu wire chip : Minimize the damage on Cu wire by chemical etching after laser operation- A few hundred microns