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# Function & Features
- Automatic chemical-etching the multi-layer of die(wafer) - The world’s first automation system. - Easy control through convenient GUI - Real-time inspection through enlarged images - Repetitions made simple using recipe files - Forced removal system for harmful gases - Safety that needs no
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# Function & Features
- Using End mill for the milling of EMC - Fast, safe, and accurate milling work- Prompt and accurate milling by robot motions (Average milling time < 1 min.) - Robot motion (X, Y, Z axis) having the precision of minimum 0.01mm (10?) - Automatically recognizing the
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# Function & Features
- All the works necessary for decap are realized through Auto Decaper. - The automated robot decapsulation system that has been developed first in the world - The functions of milling, etching, heating, acetone cleaning, drying, ultrasonic cleaning, and vision
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# Function & Features
- Automatic chemical decapsulation equipment - The functions of etching, heating, acetone cleaning, and drying available - Protecting workers from harmful chemicals - Minimizing damage etching of copper in the case of copper wired IC - Minimizing the damage on the ball or
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[Function & Features]
- Automatic laser decapsulation system - All types of semiconductor package can be removed - Any material(Au, Cu, Al) of wire part and 2nd bonding area can be opened - Effective decapsulation solution for Cu wire chip : Minimize the damage on Cu wire by chemical etching after laser operation- A few hundred microns