Features - Common cathode type surge protection diode - P/N Diode - Electrodes : Top side : Cathode (Al) Back side : Anode (Au) Application Circuits Wafer thickness : 100 µm ± 10 µm Chip size : (0.17±0.02)2 mm2 Top metal : Al or Au Back metal : Au Bonding PAD : 0.14 mm x 0.14

Features - Transient protection for data lines to IEC 61000-4-2 level4(ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 level4(EFT) 40A (tp = 5/50 ns) IEC 61000-4-5 (Lightning) 8A(tp = 8/20 µs) - Protects one I/O or power line - Low junction capacitance 30 pF - Low clamping voltage - Low leakage current - Ultra small package

Features - Common cathode type surge protection diode - P/N Diode - Electrodes : Top side : Anode (Al or Au) Back side :Cathode (Au) Chip size Includes scribe lane. The chip size is about (0.38±0.015 x 0.31±0.015) mm2 after dicing. Wafer thickness : 100 µm ± 10 µm Chip size : 0.40 mm x 0.33mm Top metal : Al

This semiconductor deodorizer, which was developed to innovatively control high-concentration combined bad smells coming from food, sewage sludge, digesters and composting facilities, continuously decomposes matters with bad smells using low amounts of energy with innovative technologies by achieving oxidative decomposition through the use of

Features - Common cathode type surge protection diode - P/N Diode - Electrodes : Top side : Cathode (Al) Back side : Anode (Au) Application Circuits Wafer thickness : 100 µm ± 10 µm Chip size : (0.17±0.02)2 mm2 Top metal : Al or Au Back metal : Au Bonding PAD : 0.14 mm x 0.14

Features - Transient protection for data lines to IEC 61000-4-2 level4(ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 level4(EFT) 40A (tp = 5/50 ns) IEC 61000-4-5 (Lightning) 8A(tp = 8/20 µs) - Protects one I/O or power line - Low junction capacitance 30 pF - Low clamping voltage - Low leakage current - Ultra small package

Introduction MS-100 Carbon CLEANER ? Features • It is able to completely dissolve metal rust, carbon deposits, and oxidized deposits without damaging the coated layer and the metal surface, at room temperature • It safely removes the rust compared to existing non-organic acid (hydrochloric acid, nitric acid, sulfuric acid) • It

Features - Common cathode type surge protection diode - P/N Diode - Electrodes : Top side : Anode (Al or Au) Back side :Cathode (Au) Chip size Includes scribe lane. The chip size is about (0.38±0.015 x 0.31±0.015) mm2 after dicing. Wafer thickness : 100 µm ± 10 µm Chip size : 0.40 mm x 0.33mm Top metal : Al

Introduction Rust Cleaner Seaclean zf Series ? Outline Seclean® ZF-C (coating type) and Seclean® ZF-D (precipitation type) are special cleansers that remove rust or scales formed on welded joints. In addition, they are able to rapidly and effectively remove various pollutants (oil, dust) in a room- temperature environment without

This semiconductor deodorizer, which was developed to innovatively control high-concentration combined bad smells coming from food, sewage sludge, digesters and composting facilities, continuously decomposes matters with bad smells using low amounts of energy with innovative technologies by achieving oxidative decomposition through the use of

Introduction DAC–107Dz High functional aluminum enchant DAC–107Dz is a surface processing agent that removes oil and the oxidized layer of the aluminum surface at once to provide an even shine. ? Features • It is able to improve the manufacturing rate by reducing the time needed for manufacturing process • By minimizing

Introduction High Performanced Gas Mixers for welding, semiconductor, food packing machine Our Technology Based on well-established technology, our volumetric mixers are reliable and built to offer a long-life service. This cost effective series is ideal for harsh environments and difficult to handle and corrosive fluids.

[ Product Description ] Closed Loop Control  High Speed & high accuracy Fast response PM BLDC Linear Servo Motor [ Product Features

BOC BOC (Board on Chip) : BOC is the structure that connects bonding pad on substrate to the bonding pad of chip with memory chip bonding side to the laminated substrate by using wire-bonding in the central slot.   It has characterstics to have the bonding and solder side of the substrate in one plane and It

[Product Description] -Solder Ball   Solder balls are commonly used in area array package such as BGA, CSP & Flip-Chip, which forms electrical & mechanical solder joint between Pacakge Substrate & Main PCB and more recently micro bumps for inter connection instead of Au or Cu wiring. Duksan Hi-Metal is one of world

[Product Description]   >> Memory Module Memory Module PCB is the module PCB that several memory semiconductor package are placed to its plane to increase DRAM semiconductor memory capacity.   - DIMM(Dual Inline Memory Module) : Memory module with several DRAM chips are mounted at the front side and back side

Product size: 1.7~82.5 liters Storage pressure: 150~300bar(2,175~4,350 psig) Product shape: concave and convex Material: MnH, Cr-Mo steel Application: CO2, O2, N2, H2, He, Ar, Air, CI2 etc. Code & Standards: KS/JIS, ISO, KGS, US CFR, CSA, KHK, EN, BS and GB, etc Catalogue: Water Volume 1 < 20 liters,20 < 58 liters, 60 <

Specifications discrete semiconductor devices 1.NEW,ORIGINAL Only 2.THE BEST PRICE 3.Perfect Quality 4.Leader

Our company offer a wide range of Semiconductor Fuses. These are manufactured by using advanced technology and superior quality raw materials. These Semiconductor Fuses are highly demanded by our clients for its best performance and also offer at market leading prices. Our major products include-- ICs Diodes Transistors IGBT Modules Capacitors