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Mixing or Dilution of Ceria, Oxide, Metal and Cu slurry for semiconductor easy to operate with touch screen Automatic/semi-automatic/manual mode with PLC Optimal design by 3D CAD for easy maintenance Deposition-free piping design Auto flushing to avoid precipitation in the
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Slurry Agitator Pump- Sand or sediment removal from sumps or basins.- High head slurry pumping.- Highly efficient coper wound, air filled motor with class F insulation.- Heavy duty cast iron
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The slurry product of OMYA Korea is the best product made by self-developed special ultra fine grinding process, excellent purification process and perfect automation
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Application : Sapphire wafer lapping
Product characteristic
- Particle size of the polishing slurry : 3, 4.5, 6, 9?
- Increase in Material Removal Rates (MRR)
- Improvement in polishing effects on the surface of sapphire wafers (Decrease in surface roughness [Ra])
Expected Effects
- Higher than other companies lapping
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The slurry mixing system enables simple controlling of slurry consistency and mixing in other substances.With simple system modification to meet clients' requests, modifications are flexibly arrangedBy minimizing the generation of sedimentation via adopting a humidifier, slurry supply is carried out on a stable basis.Slurry gelitinization
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CMP Slurry Abrasive
In the semiconductor manufacturing process, Chemical Mechanical Polishing (CMP) is a technique used in semiconductor fabrication for planarizing the top surface of an in-process semiconductor wafer. In CMP process, the semiconductor substrate is polished by metal-oxide slurry using elastomer pad. According to the substrate,
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The slurry product of OMYA Korea is the best product made by self-developed special ultra fine grinding process, excellent purification process and perfect automation system.