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Application
Surface treatment & organic cleaning
Pre photo cleaner
Pre dego cleaner
Pre etcher cleaner
Pre PI cleaner for FPD
Specification
Process gas : N2, CDA (air)
Cooling method : natural cooling
Plasma type : DBD type (dielectric barrier discharge)
Features
Effective for continuous processing
Free damage for
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Features
Coating uniformity (10mm edge exclusion)
Machine direction : within ± 1.2%Transeverse direction : with ± 1.0%
Coating thickness range : 0.7~3 ?
Tact time : =60sec
Particle sensing resolution : = 120 ?
Discolor : None
Option
Application to large glass substrates coating for all flat planel display with high precision
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Features
Use bulk trailer, Y-cylnder, drum, bundle for high consumption
Cost downLess cylinder changeLess purge cycle/ volume
Safe operation
3D cad design
Option
Application gases (SiH4, NH3, NF3, CF4, C2F6 etc)
Heating and load cell for liquified gas
Backu process line
Component for high flow rate (regulator, filter etc )
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Item
300mm wer station for 300mm semiconductor
F type
Specification
Hybrid bath (new cleaning and drying system)
Face to face, processing of half pitched 50 wafers per batch
Chemical recycle of unit
Environmental-friendly cleaning process
20FOUP storage
Features
High reliable wafer transfer system
Low CoO by reduced DIW,
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Cleaner
Application : TFT, Color Filter, Cell, PDP, OLED
Clean Performance =95%
Vaccum Dry
Open & close system : Gate door type
Vaccum chamer material : AL5052
Glass loading/ unloading : Lifter pine type
Vacuum exhaust : Vacuum pressure -
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Item
Wet etcher, wet stripper, wet developer
Wet cleaner, rework
Specification
Application : TFT-LCD, color filter, cell, PDP
Option : UV, ultra sonic, chemical brush, dip bath, B/J, nozzle oscilation
Dryer type : Air knife with outstanding performance for 4th~8th generation
Features
Applicable to 4th ~8th generation TFT-LCD