Application Surface treatment & organic cleaning Pre photo cleaner Pre dego cleaner Pre etcher cleaner Pre PI cleaner for FPD Specification Process gas : N2, CDA (air) Cooling method : natural cooling Plasma type : DBD type (dielectric barrier discharge) Features Effective for continuous processing Free damage for

Features Coating uniformity (10mm edge exclusion) Machine direction : within ± 1.2%Transeverse direction : with ± 1.0% Coating thickness range : 0.7~3 ? Tact time : =60sec Particle sensing resolution : = 120 ? Discolor : None Option Application to large glass substrates coating for all flat planel display with high precision

Features Use bulk trailer, Y-cylnder, drum, bundle for high consumption Cost downLess cylinder changeLess purge cycle/ volume Safe operation 3D cad design Option Application gases (SiH4, NH3, NF3, CF4, C2F6 etc) Heating and load cell for liquified gas Backu process line Component for high flow rate (regulator, filter etc )

Item 300mm wer station for 300mm semiconductor F type Specification Hybrid bath (new cleaning and drying system) Face to face, processing of half pitched 50 wafers per batch Chemical recycle of unit Environmental-friendly cleaning process 20FOUP storage Features High reliable wafer transfer system Low CoO by reduced DIW,

Cleaner Application : TFT, Color Filter, Cell, PDP, OLED Clean Performance =95% Vaccum Dry Open & close system : Gate door type Vaccum chamer material : AL5052 Glass loading/ unloading : Lifter pine type Vacuum exhaust : Vacuum pressure -

Item Wet etcher, wet stripper, wet developer Wet cleaner, rework Specification Application : TFT-LCD, color filter, cell, PDP Option : UV, ultra sonic, chemical brush, dip bath, B/J, nozzle oscilation Dryer type : Air knife with outstanding performance for 4th~8th generation Features Applicable to 4th ~8th generation TFT-LCD